Universal Scientific Industrial

微小化

微小化現今變得更加重要,特別是對於移動設備,物聯網(IoT)和可穿戴電子產品。通過我們微小化解決方案,可以減小大多數電子系統尺寸以滿足市場需求。

微小化技術帶來的優點。

  • 降低材料成本
  • 可整合更多的功能
  • 更便於攜帶或運輸
Universal Scientific Industrial

Encapsulation

Encapsulation provides an economical way to protect device packages by isolating the active devices from environmental pollutants. At the same time, it offers mechanical protection by structural coupling of the device to the constituent packaging materials into a robust package. Transfer molding which includes selective molding and dual molding is normally used encapsulation.

Selective Molding

  • Universal Scientific Industrial

    Selective Molding

Universal Scientific Industrial

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Universal Scientific Industrial
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